Electronic Component Failure Analysis: Methods And Experience
Electronic Component Failure Analysis: Methods And Experience
A Practical Guide To Instrument-Based Failure Diagnosis For Beginners
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Author:
STEVE SUNG
This book provides practical experience in electronic factories for students majoring in electronics, beginners in electronics, and professionals in the electronics industry. It covers topics not taught in schools and introduces the causes of electronic component failure analysis.
This book provides practical experience in electronic factories for students majoring in electronics, beginners in electronics, and professionals in the electronics industry. It covers topics not taught in schools and introduces the causes of electronic component failure analysis. The colorful graphic analysis report allows you to absorb the author`s years of experience. Beginners can learn a lifetime`s worth of analysis tools in one go and quickly accumulate a year`s worth of expertise. Content includes: BGA analysis DYE and PRY test 2D/3D X-ray analysis Silver migration analysis EDX energy dispersive spectroscopy reports Sulfurization test, Flux, foreign matter intrusion, salination, and carbon deposit analysis Soldering ability test FTIR Fourier transform infrared spectrometer reports XRF fluorescent X-ray hazardous substance analyzer reports LED popcorn stress failure Electrostatic damage C-SAM ultrasonic inspection And various component failure analysis reports.
Genre: TECHNOLOGY & ENGINEERING / Electronics / Circuits / General